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RESEARCH PAPER · IEEE Access · 2020

Diffusion Barrier Prediction of Graphene and Boron Nitride for Copper Interconnects by Deep Learning

Manareldeen Ahmed, Yan Li, Wenchao Chen, Er‐Ping Li

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15 direct citing papers in this saved network. Explore the next layer with second-order citations.

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Diffusion Barrier Prediction of Graphene and Boron Nitride for Copper Interconnects by Deep LearningOriginalFirst-principles investigation of copper diffusion barrier performance in defective 2D layered materials*6Hexagonal Boron Nitride for Next‐Generation Photonics and Electronics180Thermal Stability of Self-Assembled 3-Aminopropyltrimethoxysilane Diffusion Barrier Terminated by Carboxyl Groups2Incorporation of tungsten or cobalt into TaN barrier layers controls morphology of deposited copper7When Machine Learning Meets 2D Materials: A Review156Density Functional Theory-Fed Phase Field Model for Semiconductor Nanostructures: The Case of Self-Induced Core–Shell InAlN Nanorods86Enhancing CO 2 hydrogenation via nitrogen-doped carbon nanospheres and in situ ruthenium nanoparticle synthesis3Exploring ultrathin tungsten disulfide as a diffusion barrier for copper interconnects: advanced packaging reliability and a first-principles study1DFT and machine learning insights on the orbital dependence of single-metal sites on coordination environment for lithium-sulfur batteries7Electrostatic potential distribution image-transfer learning method for highly accurate prediction of lithium diffusion barriers on transition metal dichalcogenide surfaces0Molecularly tailored SAMs for Ru interconnects: high-temperature stability, suppressed metal diffusion, and enhanced adhesion4Review of carbon nanotube on-chip interconnects in RLC prediction using artificial intelligence1First-principles evaluation of Janus TiMC MXenes as Cu interconnect barrier layers0Review: Research progress on nano-filler modified epoxy anti-corrosion coatings2Migration-Enhanced Synthesis of 2D Copper Telluride Ultrathin Thermoelectrics0

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  1. First-principles investigation of copper diffusion barrier performance in defective 2D layered materials*

    Nanotechnology · 2022-01-05

    Manareldeen Ahmed, Yan Li, Wenchao Chen, Er‐Ping Li

    Read original paper ↗ ·

  2. Hexagonal Boron Nitride for Next‐Generation Photonics and Electronics

    Advanced Materials · 2022-06-23

    Seokho Moon, Jiye Kim, Jiye Kim, Jeonghyeon Park, Semi Im, Jawon Kim, Jawon Kim, Inyong Hwang, Jong Kyu Kim, Jong Kyu Kim

    Read original paper ↗ ·

  3. Thermal Stability of Self-Assembled 3-Aminopropyltrimethoxysilane Diffusion Barrier Terminated by Carboxyl Groups

    Applied Sciences · 2022-11-02

    Hongjin Liu, Mingkun Fu, Zhe Wang, Shaozhi Pang, Huaiqing Zhu, Chen Zhang, Lijun Ming, Xinyu Liu, Minghui Ding, Yudong Fu

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  4. Incorporation of tungsten or cobalt into TaN barrier layers controls morphology of deposited copper

    Journal of Physics Materials · 2023-06-15

    Cara‐Lena Nies, Michael Nolan

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  5. When Machine Learning Meets 2D Materials: A Review

    Advanced Science · 2024-01-26

    Bin Lu, Yuze Xia, Yuqian Ren, Xie Miaomiao, Liguo Zhou, Giovanni Vinai, Simon A. Morton, Andrew T. S. Wee, Wilfred G. van der Wiel, Wen Zhang, Ping Kwan Johnny Wong

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  6. Density Functional Theory-Fed Phase Field Model for Semiconductor Nanostructures: The Case of Self-Induced Core–Shell InAlN Nanorods

    Crystal Growth & Design · 2024-05-14

    Manoel Alves Machado Filho, William Farmer, Ching‐Lien Hsiao, Renato Batista dos Santos, Lars Hultman, Jens Birch, Kumar Ankit, Gueorgui Kostov Gueorguiev

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  7. Enhancing CO 2 hydrogenation via nitrogen-doped carbon nanospheres and in situ ruthenium nanoparticle synthesis

    Catalysis Science & Technology · 2025-01-01

    Pradeep S. Murthy, Oliver J. Conquest, Lizhuo Wang, Xiaoyan Liu, Jian Liu, Catherine Stampfl, Jun Huang

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  8. Exploring ultrathin tungsten disulfide as a diffusion barrier for copper interconnects: advanced packaging reliability and a first-principles study

    Materials Today Nano · 2025-05-07

    Vijay D. Chavan, Touko Lehenkari, Suhas Yadav, Ruhan E. Ustad, Zulfqar Ali Sheikh, Ajay T. Avatare, Tushar P. Kamble, Laraib Sajjad, Hannu‐Pekka Komsa, Sandip R Sabale, Kyeong-Keun Choi, Seungbae Park, Ghulam Dastgeer, Honggyun Kim, Deok‐kee Kim

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  9. DFT and machine learning insights on the orbital dependence of single-metal sites on coordination environment for lithium-sulfur batteries

    Journal of Energy Storage · 2025-08-19

    S. Susanna Victoria Backiyaleela, Anand Rajkamal, Kang-Hyun Lee, K.M. Mithra, Gun Jin Yun, Hern Kim, S. Sinthika

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  10. Electrostatic potential distribution image-transfer learning method for highly accurate prediction of lithium diffusion barriers on transition metal dichalcogenide surfaces

    Journal of Zhejiang University. Science A · 2025-10-01

    Jian Chen, Yao Kang, Xudong Wang, Hao Min Huang, Man Yao

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  11. Molecularly tailored SAMs for Ru interconnects: high-temperature stability, suppressed metal diffusion, and enhanced adhesion

    NPG Asia Materials · 2025-11-29

    Hongyi Wu, Yi-Ying Fang, Yulin Chen, J. Lu, Ming‐Yen Lu, Shou-Yi Chang, Pei Yuin Keng

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  12. Review of carbon nanotube on-chip interconnects in RLC prediction using artificial intelligence

    Materials Today Communications · 2025-12-22

    Kola Balavani, Padmavathy N, Nalini Bodasingi

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  13. First-principles evaluation of Janus TiMC MXenes as Cu interconnect barrier layers

    RSC Advances · 2026-01-01

    Bowen Li, Zhiyong Li, Shuting Wang, Mingpeng Chen, Yanxin Qiao, Yao Xiang

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  14. Review: Research progress on nano-filler modified epoxy anti-corrosion coatings

    Journal of Materials Science · 2026-04-03

    Binghua Hou, Tianyu Lan, Liwu Zu, Shaobo Dong, Shengnan Liu, Xiaochen Bao, Jinying Yan, Jifa Liu, Ping Zhang, Jiaxing Xie

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  15. Migration-Enhanced Synthesis of 2D Copper Telluride Ultrathin Thermoelectrics

    ACS Nano · 2026-04-06

    Yu‐Chi Yao, You-Chen Lin, Song Fu Yao, Zhi‐Long Yen, Jian-Jhang Lee, Hao‐Ting Chin, Ding‐Rui Chen, Po-Han Lin, Chia‐Chun Chen, Mario Hofmann, Ya‐Ping Hsieh

    Read original paper ↗ ·
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