RESEARCH ARTICLE · Materials Today Nano · 2025
Exploring ultrathin tungsten disulfide as a diffusion barrier for copper interconnects: advanced packaging reliability and a first-principles study
Vijay D. Chavan, Touko Lehenkari, Suhas Yadav, Ruhan E. Ustad, Zulfqar Ali Sheikh, Ajay T. Avatare, Tushar P. Kamble, Laraib Sajjad, Hannu‐Pekka Komsa, Sandip R Sabale, Kyeong-Keun Choi, Seungbae Park, Ghulam Dastgeer, Honggyun Kim, Deok‐kee Kim
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