RESEARCH PAPER · Small Structures · 2026
Atomic Layer Deposited Cu Incorporation Enables Enhanced Thermoelectric Performance in n‐Type Mg 3 (Sb, Bi) 2
Jun Li, Shiyang He, Falk Röder, Jonas Winkler, Panpan Zhao, Kyuseon Jang, S. Zhang, Abhishek Pandey, Angelika Wrzesińska, Yana Vaynzof, Christina Scheu, Kornelius Nielsch, Amin Bahrami
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