RESEARCH PAPER · Ceramics International · 2026
Design and interfacial characterization of high-strength Cu/Si3N4 joints via high-entropy filler engineering
Haifeng C. Xu, Junjun Yang, Jie Wang, Fengsong Fan, Zepeng Zhang, Zhirui Zhang, Deyin Zhang, Haoyang Wu, Aimin Chu, Baorui Jia, Xuanhui Qu, Mingli Qin
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