RESEARCH PAPER · Applied Surface Science · 2025
Interplay of deposition kinetics with metal diffusion in MoO 3 -Cu heterojunctions
Edoardo Torretti, Francesco Paparoni, J.D. Cook, Alessandro D’Elia, Andrea Di Cicco, Ludovic Douillard, M. Fauré, A. Marcelli, Marco Minicucci, William O’Neill, E. Rollin, Martin Sparkes, B. Spataro, N. Lockwood, S.J. Rezvani
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