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RESEARCH PAPER · Acta Materialia · 2023

Examination of NCSL (near-coincidence site lattice) structures formed during β2 (Ni3-xTe2) precipitation in diffusion-bonded PbTe-Ni interfaces – A TEM study

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Examination of NCSL (near-coincidence site lattice) structures formed during β2 (Ni3-xTe2) precipitation in diffusion-bonded PbTe-Ni interfaces – A TEM studyOriginalEditorial: A vote of thanks to our departing editors0Synergistic enhancement of photoluminescence and advanced deep learning model through YOLOv8x in combined effects of carbon dots and Sr₉Al₆O₁₈:Sm³⁺ phosphors11Revealing electrical and mechanical degradation of Ni/Bi2Te3 interface through the quantitative interfacial diffusion analysis1Beyond inertness: a critical perspective on design strategies for stable thermoelectric interfaces2Effect of Mg alloying on the damping and compression properties of layered Cu-11.9Al-xMg alloys1

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  1. Editorial: A vote of thanks to our departing editors

    Journal of Materials Science · 2024-11-01

    C. Barry Carter

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  2. Synergistic enhancement of photoluminescence and advanced deep learning model through YOLOv8x in combined effects of carbon dots and Sr₉Al₆O₁₈:Sm³⁺ phosphors

    Optical Materials · 2024-11-28

    B.R. Radha Krushna, I.S. Pruthviraj, S.C. Sharma, S. Vijayanand, C. Krithika, Liza Mohapatra, R. Pappa Ammal, Sanjan Kumar, Krishtappa Manjunatha, Sheng Yun Wu, SeGi Yu, Hanumanthappa Nagabhushana

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  3. Revealing electrical and mechanical degradation of Ni/Bi2Te3 interface through the quantitative interfacial diffusion analysis

    Materials Today Physics · 2025-06-11

    Tian Qiu, Zhi Li, Jie Zhou, Man Zhou, Shucheng Bao, Wei Xing Zhu, Yuan Shi Deng

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  4. Beyond inertness: a critical perspective on design strategies for stable thermoelectric interfaces

    Journal of Materials Chemistry A · 2025-12-24

    Surafel Shiferaw Legese, K. Chattopadhyay

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  5. Effect of Mg alloying on the damping and compression properties of layered Cu-11.9Al-xMg alloys

    Materials Characterization · 2026-07-05

    Yangyang Cheng, Rui Shu, Hongliang Sun, C Y Liu, Zheng Zhong, David Hui, Xiaosong Jiang

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