RESEARCH PAPER · Materials Today Physics · 2023
The role of interstitial Cu on thermoelectric properties of ZrNiSn half-Heusler compounds
Ruijuan Yan, Chen Shen, Marc Widenmeyer, Ting Luo, Robert Winkler, Esmaeil Adabifiroozjaei, Ruiwen Xie, Songhak Yoon, Emmanuelle Suard, Leopoldo Molina‐Luna, Hongbin Zhang, Wenjie Xie, Anke Weidenkaff
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