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RESEARCH PAPER · Applied Physics Reviews · 2022

Structured illumination with thermal imaging (SI-TI): A dynamically reconfigurable metrology for parallelized thermal transport characterization

Qiye Zheng, Divya Chalise, Mingxin Jia, Yuqiang Zeng, Minxiang Zeng, Mortaza Saeidi‐Javash, A. N. M. Tanvir, Gottlieb Uahengo, Sumanjeet Kaur, Javier E. Garay, Tengfei Luo, Yanliang Zhang, Ravi Prasher, Chris Dames

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16 direct citing papers in this saved network. Explore the next layer with second-order citations.

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Structured illumination with thermal imaging (SI-TI): A dynamically reconfigurable metrology for parallelized thermal transport characterizationOriginalReview of Flexible Wearable Sensor Devices for Biomedical Application105Hybrid Data‐Driven Discovery of High‐Performance Silver Selenide‐Based Thermoelectric Composites32Pulsed thermoreflectance imaging for thermophysical properties measurement of GaN epitaxial heterostructures13Spatially resolved lock-in micro-thermography (SR-LIT): A tensor analysis-enhanced method for anisotropic thermal characterization14Structured illumination with infrared imaging for measuring thermal conductivity0Simultaneous measurement of thermal conductivity and heat capacity across diverse materials using the square-pulsed source (SPS) technique27An instrumentation guide to measuring thermal conductivity using frequency domain thermoreflectance (FDTR)35Self-Heating Conductive Ceramic Composites for High Temperature Thermal Energy Storage11Formalism to image the dynamics of coherent and incoherent phonons with dark-field X-ray microscopy using kinematic diffraction theory2Multi-material additive manufacturing of energy storage and conversion devices: Recent progress and future prospects23Three-dimensional (3D) tensor-based methodology for characterizing 3D anisotropic thermal conductivity tensor11Wide‐Field Bond Quality Evaluation Using Frequency Domain Thermoreflectance with Deep Neural Network Feature Reconstruction4Anisotropic thermal characterization of suspended and spin-coated polyimide films using a square-pulsed source method4Simultaneous measurement of thermal conductivity of insulation materials in thickness and in-plane directions5Planar 3 ω and 2 ω method for increased sensitivity to through-plane thermal properties0Physics-guided, uncertainty-aware machine learning for non-invasive deep thermal interface characterization in hybrid-bonded 3D ICs without prior geometric knowledge2

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16 direct citing papers saved.

  1. Review of Flexible Wearable Sensor Devices for Biomedical Application

    Micromachines · 2022-08-26

    Xueli Nan, Xin Wang, Tongtong Kang, Jiale Zhang, Lanxiao Dong, Jinfeng Dong, Peng Xia, Donglai Wei

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  2. Hybrid Data‐Driven Discovery of High‐Performance Silver Selenide‐Based Thermoelectric Composites

    Advanced Materials · 2023-07-26

    Wenjie Shang, Minxiang Zeng, A. N. M. Tanvir, Ke Wang, Mortaza Saeidi‐Javash, Alexander W. Dowling, Tengfei Luo, Yanliang Zhang

    Read original paper ↗ ·

  3. Pulsed thermoreflectance imaging for thermophysical properties measurement of GaN epitaxial heterostructures

    Review of Scientific Instruments · 2023-09-01

    Zhi-Ke Liu, Guang Yang, Bing Cao

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  4. Spatially resolved lock-in micro-thermography (SR-LIT): A tensor analysis-enhanced method for anisotropic thermal characterization

    Applied Physics Reviews · 2024-04-09

    Dihui Wang, Heng Ban, Puqing Jiang

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  5. Structured illumination with infrared imaging for measuring thermal conductivity

    Journal of Physics Conference Series · 2024-05-01

    Ashwath Bhat, Chris Dames

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  6. Simultaneous measurement of thermal conductivity and heat capacity across diverse materials using the square-pulsed source (SPS) technique

    International Communications in Heat and Mass Transfer · 2024-07-27

    Tao Chen, Shangzhi Song, Yang Shuo Shen, Kexin Zhang, Puqing Jiang

    Read original paper ↗ ·

  7. An instrumentation guide to measuring thermal conductivity using frequency domain thermoreflectance (FDTR)

    Review of Scientific Instruments · 2024-10-01

    Dylan J. Kirsch, Joshua B. Martin, Ronald J. Warzoha, Mark J. McLean, Donald Windover, Ichiro Takeuchi

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  8. Self-Heating Conductive Ceramic Composites for High Temperature Thermal Energy Storage

    ACS Energy Letters · 2025-01-27

    Lin Tai Yang, Peng Peng, Nathaniel Weger, Sean H. Mills, Clément Messeri, Akanksha K. Menon, Steven E. Zeltmann, Finn Babbe, Qiye Zheng, Chaochao Dun, Chuan Zhang, Jeffrey J. Urban, Andrew M. Minor, Ravi Prasher, Hanna Marie Breunig, Sean Lubner

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  9. Formalism to image the dynamics of coherent and incoherent phonons with dark-field X-ray microscopy using kinematic diffraction theory

    Journal of Applied Crystallography · 2025-02-25

    Darshan Chalise, Yifan Wang, Mariano Trigo, Leora E. Dresselhaus‐Marais

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  10. Multi-material additive manufacturing of energy storage and conversion devices: Recent progress and future prospects

    Applied Physics Reviews · 2025-03-01

    Naimul Arefin, Hur‐E‐Jannat Moni, David Espinosa, Weilong Cong, Minxiang Zeng

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  11. Three-dimensional (3D) tensor-based methodology for characterizing 3D anisotropic thermal conductivity tensor

    International Journal of Heat and Mass Transfer · 2025-03-01

    Dihui Wang, Heng Ban, Puqing Jiang

    Read original paper ↗ ·

  12. Wide‐Field Bond Quality Evaluation Using Frequency Domain Thermoreflectance with Deep Neural Network Feature Reconstruction

    Advanced Materials Interfaces · 2025-04-10

    Amun Jarzembski, Siddharth Nair, Wyatt Hodges, Matthew B. Jordan, Anthony E. McDonald, Logan Antiporda, Greg W. Pickrell, Timothy Walsh, Fabio Semperlotti, Jason C. Neely, Luke Yates

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  13. Anisotropic thermal characterization of suspended and spin-coated polyimide films using a square-pulsed source method

    International Journal of Heat and Mass Transfer · 2025-08-30

    Bingjiang Zhang, Dihui Wang, Tao Chen, Heng Ban, Puqing Jiang

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  14. Simultaneous measurement of thermal conductivity of insulation materials in thickness and in-plane directions

    Applied Thermal Engineering · 2025-09-02

    Jeonghoon Lee, Kento Fuji, Jeonghoon Lee, Keisuke Hara, Ryo Hayasaka, Takahiro Ohmura

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  15. Planar 3 ω and 2 ω method for increased sensitivity to through-plane thermal properties

    International Journal of Heat and Mass Transfer · 2025-11-05

    Darshan Chalise, Brinthan Kanesalingam, Divya Chalise

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  16. Physics-guided, uncertainty-aware machine learning for non-invasive deep thermal interface characterization in hybrid-bonded 3D ICs without prior geometric knowledge

    International Journal of Heat and Mass Transfer · 2026-03-21

    Yicong Qiu, Chenhan Liu, Yuqiang Zeng, Qiye Zheng

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