RESEARCH PAPER · Journal of Materials Chemistry C · 2020
Tailoring the thermoelectric and structural properties of Cu–Sn based thiospinel compounds [CuM 1+x Sn 1−x S 4 (M = Ti, V, Cr, Co)]
Cédric Bourgès, Bhuvanesh Srinivasan, Bruno Fontaine, Philipp Sauerschnig, Alizée Minard, Jean‐François Halet, Yuzuru Miyazaki, David Berthebaud, Takao Mori
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