RESEARCH PAPER · Microelectronics Reliability · 2015
Interfacial reaction and failure mode analysis of the solder joints for flip-chip LED on ENIG and Cu-OSP surface finishes
Read original paper ↗See where this research leads.
A citation map has not been saved for this paper yet.
Open in your workspace →Open your workspace to prepare the citation network.
The paper record is available below. Preparing a network uses the existing account and source-allowance controls.
Papers that cite this work
No saved citation network is available; this does not mean the paper has no citations.